Sputtering is a technique used to deposit thin films of a material onto a surface (a.k.a. "substrate"). A gaseous plasma is created and the ions from this plasma are accelerated into a source material (a.k.a. "target") which is eroded by the ions and ejected in the form of neutral particles - either individual atoms, clusters of atoms or molecules. As these particles are ejected they travel in a straight line unless they come into contact with something - other particles or a nearby surface.

View equipment using this technology.